Gold-Tin (Au-Sn)

AIM’s Au80/Sn20 alloy is composed of 80% gold and 20% tin. Au80/Sn20 is a eutectic alloy with a melting point of 280°C (536°F) for soldering to gold surfaces.


Typical applications include plating, corrosion protection, and use as a base for soldering to micro-electronics, wave solder, and SMT printed circuit board assemblies.  Key properties are:

  • Storage: Indefinite shelf life if proper storage conditions are observed.
  • Flux Compatibility: Alloy Au80/Sn20 is compatible with most electronic grade, high-temperature fluxes.
  • High Purity
  • Good For: High Reliability and High Temperature Applications
Gold-Tin Solder Forms Available from AIM:

> Solder Preforms & Foils: Any size/shape/thickness

> Cored and Solid Wire

> Bar, Ingot & Anode Forms

> Paste & Powder