Indium Thermal Interface Materials & Preforms

Pure indium foils make excellent thermal interface materials for chip to lid, lid to heatsink, device to board, and temporary TIM’s for testing applications. 

FEATURES & BENEFITS

Indium imparts it’s unique properties in many indium solder alloy compositions.  Key properties are:

  • High Thermal Conductivity: >80W/m-k (bulk material)
  • High Ductility: Indium can absorb CTE mismatch between semiconductors & package lids/heat sinks
  • Compliant:  Indium fills gaps and will wet to metallic and non-metallic surfaces
Available forms from AIM:

> Indium TIM’s:  Standard and custom shapes to fit any package.
> Indium Foils:  Any width/length/thickness for R&D and pilot scale production.
> Indium Alloys: Standard and custom alloys for use as solder-TIM’s